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工业控制软硬结合板

Specifications

层数

6层(2层FPCB+4层PCB)

线宽线距

0.25mm/0.2mm

最小孔径

0.15mm

表面处理

沉镍钯金,镍厚:3-8um,钯厚:0.05-0.15um,金厚:0.05-0.15um

工艺

金线banding

特殊材料

埋盲孔

Applicable solutions

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